The Ultra Thin Vapor Chamber Heatsink For Cell Phone Cooling Is Ready For Production

      Recently， Sinda Thermal engineer team is working with customer for the vapor chamber thermal solution for the cell phone applications. We use the 0.5mm ultra thin copper vapor chamber design to support about 15W TDP.  After many improvement and trying, we finally pass the thermal test at customer site. We are ready for the mass production of this vapor chamber, thanks for choosing Sinda Thermal .

     The vapor chamber is a two-phase fluid device formed by pouring pure water into a container full of micro structures. Heat enters the plate through heat conduction from the external high temperature area, and the water around the point heat source will quickly absorb the heat and be vaporized into steam, taking away a large amount of heat energy.